The Datapaq® Reflow Tracker® temperature profiling system travels through the process, enabling you to monitor wave and reflow soldering, as well as vapor phase, selective soldering and rework stations. Comprised of specifically designed thermocouples, data loggers, protective thermal barriers and Insight software, this system will help you optimize product quality, expedite process setup, increase yields and minimize the need for rework.
For more details and specifications, download the Reflow Tracker System brochure.
Insight Software for Reflow Tracker available in Basic, Standard and Professional versions
Insight software is an easy-to-use analysis package designed by Datapaq to meet the needs of the electronics assembly industry. With a typical reflow soldering profile lasting only six minutes, users don’t want to spend additional time analyzing the profile. Insight Software ensures that the user is presented with a detailed analysis immediately and it comes in the following versions:
Insight Basic Software for Reflow Tracker has the power needed to convert raw data into information quickly and easily. It has wizards to guide infrequent users helping to ensure that each step is carried out efficiently. The result is a cost-effective and easy-to-use software solution that can used to analyze the soldering profile in depth and provide full reports on process performance.
Insight Standard Software for Reflow Tracker, the solution of choice for many users, builds on the basic software by adding both profile prediction and recipe calculation functionality. This transforms the basic profile analysis software into a full process optimization solution. The Easy Oven Setup recipe calculator can calculate the optimum oven settings in seconds, thus saving hours at every process changeover.
Insight Professional Software for Reflow Tracker is the choice of the frequent user and in high volume production environments. The Professional software includes the ability to eliminate the variability associated with the use of golden boards by use of the Datapaq Surveyor concept. The enhanced SPC Surveyor analysis software is designed to spot trends in your oven’s performance and avoid processes that are out of specification. Add the option of the adjustable width frame with Surveyor sensors, and you have the complete setup, optimization and long term process monitoring solution.
For detailed information, download the following supporting documents:
You can also visit our software downloads page to download free software demos.
Datapaq DP5 Datalogger
The Datapaq DP5 is rugged and reliable temperature data logger utilizing the latest electronic technology to ensure the optimal size/performance balance. It can take readings from up to 12 thermocouples at a faster speed, finer resolution and greater accuracy than has previously been done in the temperature profiling industry. It is housed in a machined-from-solid aluminum case to ensure longest service life and lowest cost of ownership.
The Datapaq DP5 features include:
- Temperature range: -100°C to 1370°C/-385°F to 2498°F (type K thermocouples)
- Ultra-fast USB connection using off-the-shelf USB cable
- Battery recharging from any USB power outlet
- User replaceable Nimh battery pack
- Exceptionally slim footprint – less than 60mm (2.5”) wide and low height – less than 12mm (0.5”)
- Sampling rate as low as 0.05 seconds
- 50000 readings per channel in 6 and 12 channel formats
- High accuracy +/- 0.5°C/0.9°F
- Easy-to-use Start/Stop buttons
With more than 35 years experience of designing thermal protection solutions for use in furnaces up to 1200°C (2200°F) and employing the same insulation technology as that used in an aircraft’s ‘black box’, Datapaq thermal barriers can withstand the harshest of environments. The thermal barriers are constructed from microporous insulation, housed in a high-grade stainless steel casing and are improved by easy-to-use, dual catch closures. Rugged, yet lightweight, these barriers withstand process temperatures run after run.
For system specifications, download the Reflow Tracker System Thermal Barriers brochure.
Thermocouple probes are an essential part of a Datapaq Reflow Tracker system. They are placed in critical points on the product to give a clear profile of the temperature throughout the process. No one makes a more robust probe. All Datapaq probes are constructed with alloys that conform to the highest standards (ANSI MC 96.1 Special Limits of Error) and provide the most accurate data possible.
For system specifications, download the Reflow Tracker System Thermocouples brochure.
Radio Telemetry System – allows you to see in real time what happens to your product during the soldering process. You can compare product temperatures to specification during the process. For detailed information, download the Reflow Tracker System brochure.
Surveyor System – consisting of an adjustable frame, fixed temperature sensors and enhanced SPC Surveyor analysis software, available only in Insight Professional Software, this tool is designed to spot trends in your oven’s performance and avoid processes that are out of specification.
Wave Solder Analysis Kit – a tool for regular repeatable process monitoring. It enables you to profile PCB/component temperatures, or use the pallet with its integral PCB coupon to monitor process stability and wave conditions. All critical process parameters are displayed in one, easy-to-read table – the wave and preheat data, as well as the temperature profile graph.
For detailed information, download the Wave Solder Analysis brochure.
Selective Soldering – the SelectivePaq system has been designed specifically for use in the confined space of the miniature wave selective soldering process. Combining the four channel Q18 micro logger with a thermal shield and Insight® software, the SelectivePaq is a complete solution for monitoring product temperatures throughout the selective soldering process. The addition of the optional sensor array enables process stability to be measured.
For detailed information, download the SelectivePaq datasheet.